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                歡迎來到凯发k8娱乐科技官方網站 !
                股票代碼:688216

                針對不同產品,不同 Bond Pad 結構我司開發出對應的銅線、合金線及金線工藝.

                For different products and bond pad structure, CPC developed corresponding copper, alloy and gold wire.



                焊絲直徑

                μm)


                普通



                BSOB

                 焊盤結構

                銅線產品最小頂層金屬厚度(μm

                合金線產品最小頂層金屬厚度(μm

                金線產品最小頂層金屬厚度(μm


                最小焊盤尺寸(μm


                最小焊盤中心距(μm

                最小焊盤尺寸(μm

                最小焊盤中心距(μm


                18


                40

                50

                50

                60

                ①第一▓層和第二層下無器件或電路,厚度要求按一般標準(銅線&合金線);②如有器件或電路,頂層金屬層厚度█需≥1.0um(銅線)

                0.8

                0.6

                0.4


                20


                50

                60

                60

                70

                0.8

                0.6

                0.5


                23


                60

                70

                65

                75

                0.8

                0.8

                0.8


                25


                70

                80

                75

                85

                0.8

                0.8

                0.8


                30


                85

                100

                /

                /

                若焊盤下有器件或電路,頂層金屬層厚度需≥3um

                (銅線&合金線產品)

                1.5


                32


                85

                100

                /

                /

                1.5


                38


                100

                135

                /

                /

                3


                42


                120

                140

                /

                /

                3.5


                50


                150

                170

                /

                /

                4