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                歡迎來到凯发k8娱乐科技官方網站 !
                股票代碼:688216

                圓片厚度規則

                Wafer Thickness Rule

                圓片厚度如不在凯发k8娱乐規格內必須將圓片減薄

                Back grinding is required if the thickness exceeds CPC spec.


                產品種類 

                Product Kind 

                封裝形式PKG. Type 

                圓片厚度Wafer thickness

                DIP/HDIP

                DIP7/8/10/14/16/18/20

                10~16.8 mil (250~420 um)

                HDIP12

                Qipai

                Qipai8/16

                10~12.6 mil (250~350 um)

                 SOP8

                SOP7/8/14/16

                10~12.6 mil (250~350 um)

                SOP20/24/28

                0.635 SSOP20/24

                0.65 SSOP16/20/24/28

                1.0 SSOP24

                HSOP

                HSOP28

                10~12.6 mil (250~350 um)

                ESOP

                ESOP8/16

                7~11 mil (180~280 um)

                MSOP/EMSOP

                MSOP8/10

                EMSOP8/10

                TSSOP

                TSSOP8

                7~8.6 mil (180~220 um)

                SOT

                SOT23(Small)

                6.7~8.3 mil (170~210 um)

                SOT23-3/5/6

                SOT223

                9.5~13.4mil (240~340 um)

                SOT89-3/5

                LQFP

                LQFP32/48/64

                8~10 mil (200~250 um)

                TSOT

                TSOT23-3/5/6

                5~7 mil (130~180um)

                QFN/DFN

                QFN3X3/4X4/5X5/6X6/7X7

                7~8.6 mil (180~220 um)

                DFN2X2/2X3/3X3/4X4/5X5

                5~7 mil (130~180um)

                DFN1006-2/3

                TO

                TO252

                11~13.4 mil (280~340 um)

                CPC

                CPC4/5/8/14/16/20/24

                6.7~8.3 mil (170~210 um)

                ECPC

                ECPC14/16/20/24

                6.7~8.3 mil (170~210 um)